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Articles published by JEDEC Solid State Technology Association
JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
October 01, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Announces Automotive Electronics Forum in September 2026
August 19, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory
April 22, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Announces May 2026 Forums Focused on Next-Generation Memory for AI, Server, Cloud, and Mobile Computing
April 07, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Releases Updated LPDDR5/5X SPD Standard with Enhanced Mode‑Switching Support
March 24, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards
February 26, 2026
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers
October 20, 2025
From
JEDEC Solid State Technology Association
Via
Business Wire
UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage
October 06, 2025
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
July 09, 2025
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
April 16, 2025
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
July 31, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
July 22, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations
July 10, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board
February 21, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices
January 30, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC JC-14.7 Subcommittee Broadens Focus to Include Radio Frequency Technologies
January 17, 2024
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications
November 10, 2022
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC® Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
August 17, 2022
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
January 27, 2022
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence
December 16, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications
October 26, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications
August 25, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
July 28, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense
July 07, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices
April 30, 2021
From
JEDEC Solid State Technology Association
Via
Business Wire
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