Entegris Enters Into Long-Term Supply Agreement with onsemi

INITIAL PRODUCTS TO BE SOLD INCLUDE CHEMICAL MECHANICAL PLANARIZATION (CMP) SOLUTIONS FOR SILICON CARBIDE (SiC) APPLICATIONS

Entegris, Inc. (Nasdaq: ENTG), a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, announced it has entered into a long-term supply agreement with onsemi, a leading manufacturer of advanced energy-efficient power semiconductors. Under the terms of the agreement, Entegris will provide onsemi a broad range of co-optimized chemical mechanical planarization (CMP) solutions for silicon carbide (SiC) applications.

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Silicon carbide technologies are increasingly relied on by manufacturers in several industries, including electric vehicles, power devices, renewable energy, wireless communication, and cloud computing. (Photo: Entegris)

Silicon carbide technologies are increasingly relied on by manufacturers in several industries, including electric vehicles, power devices, renewable energy, wireless communication, and cloud computing. (Photo: Entegris)

โ€œOver the past four years, Entegris has leveraged its technology and innovation to become a leader in the growing SiC market, and we are pleased to enter into this long-term supply agreement with onsemi. Entegris will provide our leading CMP solutions to onsemi to assist the company in meeting the growing demands of its customers and the overall market,โ€ said Bertrand Loy, president and CEO of Entegris.

While SiC offers critical advantages for the manufacture of advanced semiconductors, it is a very hard material that is naturally dense and chemically inert, making it difficult to achieve the desired surface quality on the wafer. With its complementary suite of CMP solutions including slurries, pads, brushes, and post-CMP cleans, Entegris is a leader for CMP solutions that enable the high-volume manufacture of SiC wafers.

According to Dann Woodland, president of Entegrisโ€™ Materials Solutions, โ€œEntegris recognizes the compelling long-term prospects of silicon carbide technologies, which are increasingly relied on by manufacturers in a number of industries, including electric vehicles, power devices, renewable energy, wireless communication, and cloud computing. Our broad portfolio of CMP solutions enables high-volume manufacturers of SiC wafers such as onsemi to polish such wafers with high yield and low defectivity.โ€

โ€œBoth parties are excited about the opportunities that this partnership presents. We believe Entegris is well-positioned to offer complementary solutions, such as specialty gases, precursors, and graphite, to meet onsemiโ€™s needs across other semiconductor manufacturing processes,โ€ Mr. Woodland said.

โ€œonsemi is one of only a few companies globally to manufacture SiC-based semiconductors from crystal growth to advanced packaging solutions, and we recognize Entegrisโ€™ ability to innovate and provide the latest in CMP solutions for silicon carbide,โ€ said Nana Tseng, chief procurement officer and vice president external manufacturing at onsemi. โ€œThe agreement with Entegris enables us to reliably meet our customersโ€™ rapidly increasing demand for innovative technologies that improve the energy efficiency in their applications.โ€

About Entegris

Entegris is a leading supplier of advanced materials and process solutions for the semiconductor and other high-tech industries. Entegris has approximately 8,000 employees throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service and/or research facilities in the United States, Canada, China, Germany, Israel, Japan, Malaysia, Singapore, South Korea, and Taiwan. Additional information can be found at www.entegris.com.

Cautions Regarding Forward Looking Statements

This news release contains โ€œforward-looking statements.โ€ The words โ€œbelieve,โ€ โ€œexpect,โ€ โ€œanticipate,โ€ โ€œintend,โ€ โ€œestimate,โ€ โ€œforecast,โ€ โ€œoutlook,โ€ โ€œproject,โ€ โ€œshould,โ€ โ€œmay,โ€ โ€œwill,โ€ โ€œwouldโ€ or the negative thereof and similar expressions are intended to identify such forward-looking statements. These forward-looking statements may include statements about fluctuations in demand for semiconductors; global economic uncertainty and the risks inherent in operating a global business; supply chain matters; inflationary pressures; future period guidance or projections; the Companyโ€™s performance relative to its markets, including the drivers of such performance; market and technology trends, including the duration and drivers of any growth trends; the development of new products and the success of their introductions; the focus of the Companyโ€™s engineering, research and development projects; and other matters. These forward-looking statements are based on current management expectations and assumptions only as of the date of this news release, are not guarantees of future performance and involve substantial risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from the results expressed in, or implied by, these forward-looking statements. These risks and uncertainties include, but are not limited to, weakening of global and/or regional economic conditions, generally or specifically in the semiconductor industry, which could decrease the demand for the Companyโ€™s products and solutions; the level of, and obligations associated with, the Companyโ€™s indebtedness, including the debts incurred in connection with the acquisition of CMC Materials, Inc. (now known as CMC Materials LLC) (โ€œCMC Materialsโ€); risks related to the acquisition and integration of CMC Materials, including unanticipated difficulties or expenditures relating thereto, the ability to achieve the anticipated synergies and value-creation contemplated by the acquisition of CMC Materials and the diversion of management time on transaction-related matters; raw material shortages, supply and labor constraints, price increases, inflationary pressures and rising interest rates; operational, political and legal risks of the Companyโ€™s international operations; the Companyโ€™s dependence on sole source and limited source suppliers; the Companyโ€™s ability to meet rapid demand shifts; the Companyโ€™s ability to continue technological innovation and introduce new products to meet customersโ€™ rapidly changing requirements; substantial competition; the Companyโ€™s concentrated customer base; the Companyโ€™s ability to identify, complete and integrate acquisitions, joint ventures, divestitures or other similar transactions; the Companyโ€™s ability to effectively implement any organizational changes; the Companyโ€™s ability to protect and enforce intellectual property rights; the impact of regional and global instabilities, hostilities and geopolitical uncertainty, including, but not limited to, the ongoing conflicts between Ukraine and Russia and between Israel and Hamas and other tensions in the Middle East, as well as the global responses thereto; the increasing complexity of certain manufacturing processes; changes in government regulations of the countries in which the Company operates, including the imposition of tariffs, export controls and other trade laws and restrictions and changes to national security and international trade policy, especially as they relate to China; fluctuation of currency exchange rates; fluctuations in the market price of the Companyโ€™s stock; and other risk factors and additional information described in the Companyโ€™s filings with the U.S. Securities and Exchange Commission (the โ€œSECโ€), including under the heading โ€œRisk Factorsโ€ in Item 1A of the Companyโ€™s Annual Report on Form 10-K for the fiscal year ended December 31, 2023, filed on February 15, 2024, and in the Companyโ€™s other SEC filings. Except as required under the federal securities laws and the rules and regulations of the SEC, the Company undertakes no obligation to update publicly any forward-looking statements or information contained herein, which speak as of their respective dates.

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