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The Angstrom Era Arrives: TSMC Dominates AI Hardware Landscape with 2nm Mass Production and $56B Expansion

Today 8:35 EST

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NVIDIA CEO Jensen Huang Champions “Sovereign AI” at WEF Davos 2026

January 23, 2026

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Silicon Photonics Breakthroughs Reshape 800V EV Power Electronics

January 23, 2026

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Intel and Innatera Launch Neuromorphic Engineering Programs for “Silicon Brains”

January 23, 2026

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“Glass Cloth” Shortage Emerges as New Bottleneck in AI Chip Packaging

January 23, 2026

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RISC-V Hits 25% Design Share as GlobalFoundries Bolsters Open-Standard Ecosystem

January 23, 2026

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AI Memory Shortage Forecast to Persist Through 2027 Despite Capacity Ramps

January 23, 2026

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India Outlines “Product-Led” Roadmap for Semiconductor Leadership at VLSI 2026

January 23, 2026

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Silicon Sovereignty: NVIDIA Blackwell Production Hits High Gear at TSMC Arizona

January 23, 2026

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US and Taiwan Announce Landmark $500 Billion Semiconductor Trade Deal

January 23, 2026

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China’s CXMT Targets 2026 HBM3 Production with $4.2 Billion IPO

January 23, 2026

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Samsung Profits Triple in Q4 2025 Amid AI-Driven Memory Price Surge

January 23, 2026

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US Eases NVIDIA H200 Exports to China with 25% Revenue Tariff

January 23, 2026

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TSMC’s Arizona “Gigafab Cluster” Scales Up with $165 Billion Total Investment

January 23, 2026

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SK Hynix Approves $13 Billion for World’s Largest HBM Packaging Plant

January 23, 2026

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Semiconductor Revenue Projected to Cross $1 Trillion Milestone in 2026

January 23, 2026

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The Power Revolution: AI and Wide-Bandgap Semiconductors Pave the Way for the $10B SiC Era

January 23, 2026

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RISC-V Rebellion: SpacemiT Unveils Server-Class Silicon as Open-Source Architecture Disrupts the Edge AI Era

January 23, 2026

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Micron Secures $1.8 Billion Taiwan Fab Acquisition to Combat Global AI Memory Shortage

January 23, 2026

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The Neuromorphic Revolution: Innatera and VLSI Expert Launch Global Talent Pipeline for Brain-Inspired Chips

January 23, 2026

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The Great Packaging Surge: TSMC Targets 150,000 CoWoS Wafers to Fuel NVIDIA’s Rubin Revolution

January 23, 2026

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The H200 Export Crisis: How a ‘Regulatory Sandwich’ is Fracturing the Global AI Market

January 23, 2026

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The Speed of Light: Ligentec and X-FAB Unveil TFLN Breakthrough to Shatter AI Data Center Bottlenecks

January 23, 2026

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The Glass Age of Silicon: Intel and Samsung Pivot to Glass Substrates to Power Next-Gen AI

January 23, 2026

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TSMC Conquers the 2nm Frontier: Baoshan Yields Hit 80% as Apple’s A20 Prepares for a $30,000 Per Wafer Reality

January 23, 2026

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The Silicon Shield: India’s Semiconductor Sovereignity Begins with February Milestone

January 23, 2026

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The Great Memory Crunch: Why AI’s Insatiable Hunger for HBM is Starving the Global Tech Market

January 23, 2026

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Samsung Electronics Breaks Records: 20 Trillion Won Operating Profit Amidst AI Chip Boom

January 23, 2026

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TSMC Unveils $250 Billion ‘Independent Gigafab Cluster’ in Arizona: A Massive Leap for AI Sovereignty

January 23, 2026

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The Dawn of the Rubin Era: NVIDIA’s Six-Chip Architecture Promises to Slash AI Costs by 10x

January 23, 2026

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