• Cost-effective in-rack systems enable testing of standard 30kW or 50kW NeuCool liquid-cooled racks without multi-million-dollar hardware investments
• Custom testing configurations available, including larger rack sizes and in-row CDUs for up to 250kW thermal loads
• Modular Load Simulation Sleds replicate the heat output of the latest high-performance CPUs and GPUs
• Integrated with patented NeuCool two-phase direct-to-chip liquid cooling technology

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, today announced the commercial availability of its Thermal Simulation Rack (TSR), featuring integrated Load Simulation Sleds (LSS). This advanced system allows data centers, ecosystem partners and technology providers to test and validate Accelsius’ advanced NeuCool^TM two-phase, direct-to-chip liquid cooling solutions without requiring multi-million-dollar investments in AI and HPC hardware.

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Data centers face unprecedented thermal management challenges as the demand for AI and other compute-intensive applications surges. With racks now capable of consuming over 100kW of power, traditional cooling methods are reaching their limits. Accelsius’ TSR addresses this critical need by providing a cost-effective, scalable platform for evaluating next-generation CPU and GPU thermal loads with its NeuCool cooling platform.

“As an industry, we’re seeing a paradigm shift in data center thermal management for increasingly powerful chips and servers,” said Dr. Rich Bonner, CTO/CPO of Accelsius. “Our Thermal Simulation Rack allows customers and partners a more data-driven approach to confidently evaluate and adopt advanced liquid cooling solutions, like our NeuCool system, ensuring they can meet the demands of next-generation computing while optimizing energy efficiency and sustainability.”

Key features of the Accelsius TSR include:

• Modular design supporting up to 50kW of simulated thermal load per rack
• Custom options support testing up to 250kW in-row
• Load Simulation Sleds (LSS) that replicate the heat output of the latest high-performance CPUs and GPUs
• Integration with Accelsius’ patented NeuCool two-phase direct-to-chip liquid cooling technology
• Comprehensive control of individual LSSs and system monitoring through an intuitive software interface
• Compatibility with various facility cooling infrastructures

The TSR is available in two standard configurations: TSR-30 (up to 30kW) and TSR-50 (up to 50kW). It can be customized in-row for up to 250kW of total power. This flexibility allows users to create realistic test environments that closely mirror their production data center conditions.

The Accelsius Thermal Simulation Rack is now available for order, with delivery times of less than 45 days from approved orders. For more information or to schedule a demonstration, visit accelsius.com or contact sales@accelsius.com.

About Accelsius

Accelsius, founded by Innventure LLC, empowers data center and edge operators to meet their business, financial and sustainability goals through next-generation cooling systems. The Accelsius NeuCool Platform delivers patented two-phase, direct-to-chip liquid cooling systems with best-in-class thermal efficiencies. NeuCool uses a sustainable, safe dielectric fluid and intelligent monitoring to provide a risk-free technology that scales from a single rack to an entire data center. NeuCool technology combined with Accelsius’ US-based manufacturing and robust professional services program gives data center operators the confidence to evolve cooling approaches while ensuring performance improvements and continued uptime. For more information, visit www.accelsius.com. LinkedIn: https://www.linkedin.com/company/accelsius/

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