Laser Photonics Corporation (NASDAQ: LASE) (“LPC”), a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.

Laser processing has emerged as an effective method of PCB depaneling due to its non-contact nature, narrow kerf width, and precision. This method eliminates part-induced stress and the need for consumables like cutting oils, ensuring cleanliness and high-quality results.

Custom-tailored depaneling laser technology by CMS Laser features high speed, pinpoint accuracy and machine vision alignment. The company offers PCB depaneling systems integrating CO2 and UV laser types. The main deciding factor when determining which laser to use is the relative importance of cycle time versus the cleanliness of the cut edge. CO2 lasers provide fast cuts and cost efficiency, while UV lasers offer clean cuts with minimal charring.

“By bringing together the talented engineers and technicians of Control Micro Systems and Laser Photonics, we plan to boost the development of PCB depaneling systems to meet the growing demand in the market,” said John Armstrong, Executive Vice President of LPC.

Many manufacturers have chosen laser routing as it’s ideal for flexible, highly sensitive, small PCBs used across electronic devices. CMS Laser’s solutions offer precision and efficiency suitable for standalone or integrated SMT line operations.

CMS Laser’s Class I PCB depaneling systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software, offering a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.

Leveraging CMS Laser’s specialized expertise, LPC is channeling resources into R&D in the PCB manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets. For more information, visit the LPC website at www.laserphotonics.com.

About Laser Photonics Corporation

Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics quickly gained a reputation as an industry leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aerospace, automotive, defense, energy, maritime, nuclear and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.

About CMS Laser

Control Micro Systems (CMS Laser), is a 40-year U.S. pioneer in software controls development for laser machines. Today, the company produces turnkey laser material processing systems for marking, cutting, drilling, welding, and more. Its cutting-edge laser systems are expertly engineered for high-precision applications in a wide range of industries and tailored to each client’s unique manufacturing needs. CMS Laser specializes in developing laser systems for the semiconductor industry, including solutions for marking and depaneling. It also counts several top 20 global life sciences companies among their customers. For more information, visit CMS Laser, a Laser Photonics company.

Cautionary Note Concerning Forward-Looking Statements

This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.

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