Boyd’s Easy to Adopt and Deploy Direct-to-Chip Liquid Cooling Loops and Coolant Distribution Units for NVIDIA GB200 NVL72 Platforms can Automate and Streamline Thermal Testing With Simplicity

Boyd, whose end-to-end artificial intelligence (AI) liquid cooling technologies make it easier for data center owners and operators to implement new AI infrastructure, announced it has developed a new rack simulating thermal testing tool to help end clients efficiently deploy liquid cooled data centers and improve time to market.

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Boyd's new Rack Emulator, developed in collaboration with NVIDIA, is easy to adopt, automating and streamlining thermal testing for direct to chip liquid cooling loops, coolant distribution units, and the full liquid cooling system for NVIDIA GB200 NVL72 platforms. Boyd's Rack Emulator simulates a server rack to help end clients validate thermal performance before connecting to data center equipment, enabling them to efficiently deploy liquid cooled data centers and improve time to market.

Boyd’s Rack Emulator simulates the pressure drop and heat dissipation of a server and uses automation to test coolant distribution units (CDUs) to validate thermal performance before connecting to data center equipment, such as NVIDIA GB200 NVL72 platforms.

The Boyd Rack Emulator is programmable and flexible to simulate any server. Connect to the liquid cooling system, input capacity and pressure drop protocols, and Boyd’s Rack Emulator operates like a server, simulating server protocols with automation. The Rack Emulator can additionally test electrical inputs to the server before the server is put in place. It is easy to operate without specialized training, making it easy to deploy at scale in data centers. Functioning as a thermal load bank and server simulator packaged in a rack size, the Rack Emulator can conveniently fit within a server row minimizing the space required to do load bank testing and simplifying server simulations. It is easy to ship, store, and handle, contributing to overall lower total cost of ownership. Boyd’s Rack Emulator is available to order now.

“Advanced AI data centers require innovative thermal technology to support high performance inference and training workloads,” says David Huang, Boyd President, Thermal Solutions Division. “Developed in collaboration with NVIDIA, Boyd’s programmable Rack Emulator is designed to speed time to deployment for liquid cooled NVIDIA Blackwell infrastructure.”

Boyd’s liquid cooling technologies and global service model enable end clients to meet thermal performance specifications in an easy-to-adopt modular design. All of Boyd’s thermal technologies are backed by a heritage of high quality, reliable performance earned through decades of liquid cooling design and manufacturing excellence.

About Boyd

Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. Our innovative engineered materials and thermal solutions advance our customers’ technology to maximize performance in the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems; enable performance-critical aircraft and security technologies; and accelerate innovation in next-generation electronics and human-machine-interface. Core to Boyd’s global manufacturing is a deep commitment to protecting the environment with sustainable, scalable, lean, strategically located regional operations that reduce waste and minimize carbon footprint.​ We empower our employees, develop their potential, and inspire them to do the right things with integrity and accountability to champion our customers’ success.

Visit us at www.boydcorp.com.

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Boyd's new Rack Emulator, developed in collaboration with NVIDIA, automates and streamlines liquid cooling system thermal testing and validation before connecting to data center equipment, like NVIDIA GB200 NVL72 platforms.