Teledyne Technologies Incorporated (NYSE: TDY) (“Teledyne”) announced today that Teledyne MEMS, a founding member and partner of the MiQro Innovation Collaborative Center (C2MI), is proud to acknowledge the Canadian and Quebec governments’ strategic investment in its expansion into the next project phase, C2MI1.5. The C$656 million investment announced today marks a milestone in strengthening Canada’s semiconductor and microelectronics ecosystem.
The funding will enable C2MI to enhance its infrastructure and capabilities, particularly in support of advanced packaging and post-processing technologies. Teledyne MEMS, a C2MI partner since 2011, views this initiative as a critical enabler for innovation and growth. Over 14 years of collaboration, Teledyne MEMS has contributed to creating 120 jobs and completing more than 30 customer projects in the partnership, spanning applications from inertial sensors and timing devices to optical MEMS, MEMS photonics, microbolometers, and BioMEMS.
“This investment in C2MI directly supports our ability to perform advanced post-CMOS processing on 200mm and 300mm wafers,” said Sébastien Michel, Vice President and General Manager, Teledyne MEMS. “It strengthens our collaboration with academic and industrial partners, enables the development of next-generation imaging sensors and other products, while accelerating innovation in photonics, MEMS, and sensor technologies.”
Teledyne MEMS remains committed to advancing microfabrication excellence and contributing to the resilience and competitiveness of North America’s semiconductor supply chain.
About Teledyne
Teledyne is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne’s website at www.teledyne.com.
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Contacts
Sébastien Michel
(450) 577-6153
