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Vertiv Unveils New Systems to Solve Speed of Deployment, Management, and Rack Power and Cooling Challenges for AI Applications

Global solutions include a consolidated management platform, prefabricated overhead infrastructure for power and liquid cooling, DC rack power, and chilled water rear door.

Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, today announced the global launch of four new systems designed to address challenges driven by the rapid growth of AI applications. Vertiv’s expanded capabilities in infrastructure management, prefabricated modular deployment, advanced thermal management, and DC power distribution provide options for managing the increased power and heat density, complexity, and operational demands of AI.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250318796195/en/

Vertiv™ Unify software is a consolidated management platform that provides real-time visibility, control, and advanced analytics across critical power and thermal infrastructure, from individual assets up to a fully connected cloud environment. The platform enhances system performance, safety, and scalability for AI-intensive data centers. Vertiv Unify offers plug-and-play configurations, simplified energy usage reporting, and global and site-specific scalability. As the only leading provider of the full suite of power train and thermal chain equipment, Vertiv now enables seamless integration and coordination across systems through Vertiv Unify.

Vertiv™ SmartRun is a unique, modular prefabricated overhead infrastructure solution that integrates high-density power distribution busbar, liquid cooling piping network, hot aisle containment, and network infrastructure into a single scalable system to support IT pods while addressing increasing rack power densities. With prefabricated assembly, plug-and-play design, and a simplified one-lift installation process, Vertiv SmartRun can deploy about 1MW or more per day, up to 85% faster to deploy on-site than traditional stick-build methods. Installation, maintenance and service are supported by Vertiv services globally to provide an end-to-end solution.

Vertiv™ CoolLoop RDHx chilled water high-density rear door heat exchanger is designed to support the increasing thermal demands of AI, high-performance computing (HPC), and other power-dense IT workloads. The compact, energy-efficient air-cooling door replacement may be deployed as a standalone solution or can support direct-to-chip liquid cooling for a room-neutral solution. The system’s integrated fan module delivers precise airflow control, reducing energy consumption while optimizing cooling performance. Vertiv CoolLoop RDHx integrates seamlessly with the liquid cooling loop, and the modular design allows integration into existing data centers, enhancing thermal efficiency and simplifying cooling infrastructure. Available globally in capacities up to 80kW, Vertiv CoolLoop RDHx is an extension of the Vertiv™ Liebert® DCD rear door heat exchanger family. The system can be supported by Vertiv™ Liquid Cooling Services, which is available to provide comprehensive lifecycle support to the entire liquid cooling ecosystem.

Vertiv™ PowerDirect Rack high-density 50V DC rack power shelf is designed to help data centers maximize power efficiency and scale with ease, in support of AI and HPC applications. It offers a complete infrastructure power solution, supporting two times the power capacity in the same footprint, when compared to traditional AC uninterruptible power supply (UPS) with separate rectification and power distribution, or lower density DC power shelves. Built for Open Compute Project (OCP) ORv3 High Power Rack (HPR) environments, it delivers high-density power and is scalable up to 132 kW per rack. Vertiv PowerDirect Rack is compatible with AC and HVDC input and offers real-time monitoring, for improved flexibility and visibility.

“With these additions to our portfolio, Vertiv provides easier end-to-end systems integration, faster deployment, improved scalability, and greater power and cooling density to address critical digital infrastructure challenges related to accelerated computing,” said Scott Armul, executive vice president, global portfolio and business units at Vertiv. “Our comprehensive range of advanced power, cooling, management, and deployment solutions positions Vertiv to uniquely support customers as they build and scale AI-driven data centers.”

For more details about these solutions, visit Vertiv.com.

About Vertiv

Vertiv (NYSE: VRT) brings together hardware, software, analytics and ongoing services to enable its customers’ vital applications to run continuously, perform optimally and grow with their business needs. Vertiv solves the most important challenges facing today’s data centers, communication networks and commercial and industrial facilities with a portfolio of power, cooling, and IT infrastructure solutions and services that extends from the cloud to the edge of the network. Headquartered in Westerville, Ohio, USA, Vertiv does business in more than 130 countries. For more information, and for the latest news and content from Vertiv, visit Vertiv.com.

Forward-Looking Statements

This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27 of the Securities Act, and Section 21E of the Securities Exchange Act. These statements are only a prediction. Actual events or results may differ materially from those in the forward-looking statements set forth herein. Readers are referred to Vertiv’s filings with the Securities and Exchange Commission, including its most recent Annual Report on Form 10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion of these and other important risk factors concerning Vertiv and its operations. Vertiv is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.

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