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Adeia Demonstrates Hybrid Bonding Technology During Chiplet Summit 2024

February 06, 2024 at 08:30 AM EST

ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.

SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center.

Over the past 30 years, Adeia has pioneered fundamental advances in the semiconductor industry. With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process nodes and advanced packaging technologies, Adeia licenses and partners with leading semiconductor companies worldwide.

“Hybrid bonding is a key enabling technology for next-generation high performance semiconductor devices. The technology enables the disaggregation of the memory array and logic circuitry, to create new chiplet architectures. Adeia’s hybrid bonding technology is increasingly being adopted in sensors, memory chips and logic devices, enhancing performance and functionality while reducing size and cost,” added Laura Mirkarimi, senior vice president, engineering at Adeia.

To find demonstrations and presentations by Adeia during the Chiplet Summit, visit:

Adeia Booth #317 – The Adeia team will showcase the latest innovations in hybrid bonding technology.

Pre-Conference Tutorial C: Advanced Packaging Methods – Presentation by Thomas Workman, senior principal integration engineer for Adeia, on “Taking Advantage of Hybrid-bonded Chiplets in Designs” on Tuesday, Feb 6, 2024 from 8:30 am to 12:00 pm PST.

Best Packaging for Chiplets Today – Adeia’s Laura Mirkarimi joins this panel session on Thursday, Feb 8, 2024 at 2:00 pm PST.

About Adeia

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work and play. For more, please visit www.adeia.com.

For Information Contact:
Investor Relations
Chris Chaney
IR@adeia.com

Media Relations
Stephanie Stocker
Conveyor Marketing
marketing@adeia.com