About Us

Laser Focus World is an industry bedrock—first published in 1965 and still going strong. We publish original articles about cutting-edge advances in lasers, optics, photonics, sensors, and quantum technologies, as well as test and measurement, and the shift currently underway to usher in the photonic integrated circuits, optical interconnects, and copackaged electronics and photonics to deliver the speed and efficiency essential for data centers of the future.

Our 80,000 qualified print subscribers—and 130,000 12-month engaged online audience—trust us to dive in and provide original journalism you won’t find elsewhere covering key emerging areas such as laser-driven inertial confinement fusion, lasers in space, integrated photonics, chipscale lasers, LiDAR, metasurfaces, high-energy laser weaponry, photonic crystals, and quantum computing/sensors/communications. We cover the innovations driving these markets.

Laser Focus World is part of Endeavor Business Media, a division of EndeavorB2B.

Laser Focus World Membership

Never miss any articles, videos, podcasts, or webinars by signing up for membership access to Laser Focus World online. You can manage your preferences all in one place—and provide our editorial team with your valued feedback.

Magazine Subscription

Can you subscribe to receive our print issue for free? Yes, you sure can!

Newsletter Subscription

A Laser Focus World newsletter subscription is free to qualified professionals:

The Daily Beam

Showcases the newest content from Laser Focus World, including photonics- and optics-based applications, components, research, and trends. (Daily)

Product Watch

The latest in products within the photonics industry. (9x per year)

Bio & Life Sciences Product Watch

The latest in products within the biophotonics industry. (4x per year)

Laser Processing Product Watch

The latest in products within the laser processing industry. (3x per year)

Get Published!

If you’d like to write an article for us, reach out with a short pitch to Sally Cole Johnson: [email protected]. We love to hear from you.

Photonics Hot List

Laser Focus World produces a video newscast that gives a peek into what’s happening in the world of photonics.

Following the Photons: A Photonics Podcast

Following the Photons: A Photonics Podcast dives deep into the fascinating world of photonics. Our weekly episodes feature interviews and discussions with industry and research experts, providing valuable perspectives on the issues, technologies, and trends shaping the photonics community.

Social Media

Bluesky • Facebook • Instagram • LinkedIn • YouTube

Meet the Laser Focus World Team

Editorial

Sales

Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology
My Watchlist
Indicators
Industrial Laser Index
Markets
Stocks
ETFs
Tools
Markets:
Overview
News
Currencies
International
Treasuries

TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum

By: via Business Wire

Ecosystem Partners Receive TSMC 2021 OIP Awards for Collaborative Efforts on Semiconductor Innovation

TSMC (TSE: 2330, NYSE: TSM) today recognized the outstanding support and contributions of 11 EDA, IP, and Cloud Alliance partners with the distinction of OIP Partner of the Year at the TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum. The OIP Partner of the Year awards honor TSMC OIP ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Their collaborative efforts effectively promote innovation in the semiconductor industry. TSMC announced award winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers, providing an ideal platform to discuss the latest technologies and design solutions for HPC, mobile, automotive, and IoT applications.

“Through the industry’s most comprehensive and vibrant ecosystem, TSMC is able to help our customers achieve next-generation silicon design and deliver best possible outcomes with our OIP partners’ collaborative power,” said Dr. L.C. Lu, TSMC Fellow and Vice President of Design and Technology Platform at TSMC. “Congratulations to the winners of TSMC OIP Partner of the Year awards. Your continuous collaboration and effort make us able to be at the forefront of technology development, while enabling our customers to take full advantage of the significant power, performance, and area improvements of TSMC’s advanced technologies to accelerate innovation for their differentiated products.”

TSMC launched the Open Innovation Platform in 2008 to reduce design barriers and promote the speedy implementation of innovation in the semiconductor design community by bringing together the creative thinking of customers and partners. The Company values design ecosystem partners and continues working with them to enable next-generation designs with certified solutions benefiting from TSMC’s latest technologies. The title of OIP Partner of the Year is awarded to partner companies working relentlessly to achieve the highest standards of design, development, and technology implementation.

The partner companies recognized with the 2021 TSMC OIP Partner of the Year awards are as follows:

The IP Alliance award winners

  • Analog/Mixed Signal IP: Silicon Creations
  • DSP IP: Cadence Design Systems, Inc.
  • Embedded Memory IP: eMemory Technology Inc.
  • Emerging IP Company: proteanTecs Ltd.
  • High-Speed SerDes IP: Alphawave IP
  • Interface IP: Synopsys, Inc.
  • Processor IP: Arm Ltd.
  • Specialty Process IP: M31 Technology

The EDA Alliance award winners

  • Joint Development of 4nm Design Infrastructure:
    • ANSYS
    • Cadence Design Systems, Inc.
    • Siemens EDA
    • Synopsys, Inc.
  • Joint Development of 3DFabric™ Design Solution:
    • ANSYS
    • Cadence Design Systems, Inc.
    • Siemens EDA
    • Synopsys, Inc.

The Cloud Alliance award winners

  • Joint Development of Cloud-Based Productivity Solution:
    • Cadence Design Systems, Inc.
    • Microsoft Corp.
    • Siemens EDA

About TSMC Open Innovation Platform® (OIP)

TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners under the common goal of shortening design time, time-to-volume, time-to-market and ultimately, time-to-revenue. The TSMC OIP features the most comprehensive design ecosystem alliance programs covering industry-leading EDA, library, IPs, Cloud, and design service partners. TSMC has worked closely with these ecosystem partners ever since the Company was established and continues to expand its libraries and silicon IP portfolio to more than 40,000 IP titles and provides more than 38,000 technology files and over 2,600 process design kits, from 0.5-micron to 3-nanometer, to customers.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies, and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.

Contacts

TSMC Spokesperson:

Wendell Huang

Vice President and CFO

886-3-505-5901

Media:

Nina Kao

Head of Public Relations

886-3-563-6688 ext.7125036

Mobile: 886-988-239-163

nina_kao@tsmc.com

Tiffany Yang

Public Relations

1-408-382-7934

tiffanyy@tsmc.com

More News

View More
3 Industrial Stocks Ready to Benefit From Fed Cuts and Spending
Via MarketBeat
Topics Economy Stocks World Trade
Tickers CC DOW NUE
A Copper Catalyst: Why Freeport-McMoRan Is Positioned to Rebound
Via MarketBeat
Topics Artificial Intelligence Economy
Tickers BAC FCX
MarketBeat Week in Review – 09/29 - 10/03
Via MarketBeat
Topics Artificial Intelligence Economy
Tickers AAPL APP BBAI BYDDF COST CRWV
After Trump Deal, Can Meta Stock Withstand TikTok’s Onslaught?
Via MarketBeat
Topics Government
Tickers GOOGL META ORCL
Alphabet: After Its Best Quarter in Decades, Is It Time to Buy?
Via MarketBeat
Topics Artificial Intelligence
Tickers GOOGL
Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.