Laser Focus World is an industry bedrock—first published in 1965 and still going strong. We publish original articles about cutting-edge advances in lasers, optics, photonics, sensors, and quantum technologies, as well as test and measurement, and the shift currently underway to usher in the photonic integrated circuits, optical interconnects, and copackaged electronics and photonics to deliver the speed and efficiency essential for data centers of the future.

Our 80,000 qualified print subscribers—and 130,000 12-month engaged online audience—trust us to dive in and provide original journalism you won’t find elsewhere covering key emerging areas such as laser-driven inertial confinement fusion, lasers in space, integrated photonics, chipscale lasers, LiDAR, metasurfaces, high-energy laser weaponry, photonic crystals, and quantum computing/sensors/communications. We cover the innovations driving these markets.

Laser Focus World is part of Endeavor Business Media, a division of EndeavorB2B.

Laser Focus World Membership

Never miss any articles, videos, podcasts, or webinars by signing up for membership access to Laser Focus World online. You can manage your preferences all in one place—and provide our editorial team with your valued feedback.

Magazine Subscription

Can you subscribe to receive our print issue for free? Yes, you sure can!

Newsletter Subscription

Laser Focus World newsletter subscription is free to qualified professionals:

The Daily Beam

Showcases the newest content from Laser Focus World, including photonics- and optics-based applications, components, research, and trends. (Daily)

Product Watch

The latest in products within the photonics industry. (9x per year)

Bio & Life Sciences Product Watch

The latest in products within the biophotonics industry. (4x per year)

Laser Processing Product Watch

The latest in products within the laser processing industry. (3x per year)

Get Published!

If you’d like to write an article for us, reach out with a short pitch to Sally Cole Johnson: [email protected]. We love to hear from you.

Photonics Hot List

Laser Focus World produces a video newscast that gives a peek into what’s happening in the world of photonics.

Following the Photons: A Photonics Podcast

Following the Photons: A Photonics Podcast dives deep into the fascinating world of photonics. Our weekly episodes feature interviews and discussions with industry and research experts, providing valuable perspectives on the issues, technologies, and trends shaping the photonics community.

Editorial Advisory Board

  • Professor Andrea M. Armani, University of Southern California
  • Ruti Ben-Shlomi, Ph.D., LightSolver
  • James Butler, Ph.D., Hamamatsu
  • Natalie Fardian-Melamed, Ph.D., Columbia University
  • Justin Sigley, Ph.D., AmeriCOM
  • Professor Birgit Stiller, Max Planck Institute for the Science of Light, and Leibniz University of Hannover
  • Professor Stephen Sweeney, University of Glasgow
  • Mohan Wang, Ph.D., University of Oxford
  • Professor Xuchen Wang, Harbin Engineering University
  • Professor Stefan Witte, Delft University of Technology

ASE Introduces powerSiP™ for Transformative Power Delivery That Increases Power Efficiencies by 50% in AI and Data Center Applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has introduced powerSiP™, a transformative power delivery platform designed to reduce signal and transmission loss while addressing current density challenges. ASE’s powerSiP™ platform today enables a vertically integrated multi-stage voltage regulator module (VRM) for higher system efficiency and lower power consumption and delivers a reduced footprint that is 25% smaller when compared to traditional side-by-side configurations. The powerSiP™ technology innovation allows a 50% increase in current density from 0.4A/mm² to 0.6A/mm² and a decrease in routing power loss from 12% to 6%, signifying a 50% reduction over a side-by-side configuration. With the Artificial Intelligence (AI) market size, reach, and impact still in early stage, ASE is innovating to meet related data center requirements, performance expectations, and power improvements, offered through powerSiP™.

The introduction of powerSiP™ corresponds with the emergence of compute power and cooling as the two most energy-intensive processes within data centers today. According to the International Energy Agency (IEA), data centers consumed 460 terawatt-hours (TWh) in 2022, representing 2% of all global electricity usage, with this set to rise to 1,000 terawatt-hours (TWh), or 8%, by 2026. This surge in energy consumption is being fueled by the ongoing proliferation of AI, which relies on powerful, yet power-draining, CPU, GPU, memory and disk systems for function, performance, and lowest possible latency. Costs have become prohibitive, and demand for innovation to counteract extreme inefficiencies in power conversion and cooling has never been greater.

Today, high voltage power delivery is brought into modern data center facilities, and it is converted to lower voltage in multiple stages ahead of microprocessor utilization. Each power conversion stage in the data center power delivery network (PDN) has high efficiency in the mid to high 90% range. However, at higher power levels, the routing losses in the path from the last DC-to-DC converter on the power delivery platform to the microprocessor start to dominate and can impact overall system efficiency. Typical systems use a single stage voltage reduction from the platform to the microprocessor and bring in power at a higher voltage to the microprocessor using the VRM. ASE’s powerSiP™ platform can help customers enable a multi-stage VRM-based PDN solution.

“The powerSiP™ platform provides an option to place the voltage regulator directly under the SoC and chiplets, and vertical integration allows a large current supply at a short power delivery path,” said YE Yeh, Vice President of Research & Development, ASE. “This successfully reduces impedance in the power delivery network thus improving system performance and functionality while simultaneously increasing overall efficiency and power density.”

“System efficiency is a top priority for architects, particularly as the world explores ways to address the growing global demand for electricity at the same time as driving down carbon emissions,” commented Patricia MacLeod, Senior Director of Corporate Communications & Industry Partnerships at ASE. “Our powerSiP™ platform signifies another step forward for ASE in our endeavor to help enable more efficient power solutions and greener data center energy utilization that aligns with our corporate commitment to sustainability.”

“AI is permeating our lives incrementally and profoundly reshaping knowledge work, business function, and human experience, supported by powerful high performance computational systems that are being optimized for efficiency within today’s data centers,” added Yin Chang, ASE’s Senior Vice President of Sales & Marketing. “Advanced packaging is playing a pivotal role, and this is the impetus behind the introduction of our powerSiP™ platform to support our customers. Offering unique advanced packaging structures and an innovative technology roadmap, powerSiP™ is evolving to deliver crucial data center system requirements including power and performance efficiencies for AI and HPC applications.”

Available now, ASE’s powerSiP™ is a transformative power delivery platform that will expand in alignment with industry roadmaps and application requirements.

Supporting resources

  • For more about powerSiP™, please visit: https://ase.aseglobal.com/powersip/
  • Visit the ASE Exhibition at ECTC 2024 in Denver, CO, May 28-29, 2024
  • Follow us on our LinkedIn page for targeted updates and announcements @aseglobal
  • Follow us on Twitter @aseglobal

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative VIPack™, advanced packaging, and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, Automotive, 5G, High-Performance Computing, and more. To learn about our advances in SiP, Fanout, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on LinkedIn & X: @aseglobal.

Contacts

Stock Quote API & Stock News API supplied by www.cloudquote.io
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms Of Service.