- D-Wave launches initiative to develop advanced cryogenic packaging for both gate-model and annealing quantum processors.
- The program will expand multichip packaging capabilities, manufacturing equipment, and processes.
- Initiative leverages expertise from NASA’s Jet Propulsion Laboratory (“JPL”) for superconducting bump-bond technology.
- The goal is to increase interconnectivity and scalability for architectures reaching 100,000 qubits.
D-Wave Quantum Inc. (NYSE: QBTS) (“D-Wave”), a leader in quantum computing systems, software, and services, has announced a strategic development program to expand its capabilities in cryogenic packaging, designed to advance and scale both gate-model and annealing quantum processors. The initiative underscores the company’s focus on hardware innovation to support its long-term technology roadmap (https://ibn.fm/WU30l).
Cryogenic packaging – the housing and interconnection of quantum processor components in extremely low-temperature environments – plays a central role in performance and scalability. In quantum computing, packaging must not only handle ultra-low temperatures but also be compatible with…
NOTE TO INVESTORS: The latest news and updates relating to QBTS are available in the company’s newsroom at https://ibn.fm/QBTS
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