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HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure

By: HyperLight Corporation via Business Wire

June 18, 2026 at 11:30 AM EDT

ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.

HyperLight Corporation (“HyperLight”), a leader in thin-film lithium niobate (TFLN) photonics, today announced the closing of an $80 million Series C financing round led by MediaTek. The round includes participation from UMC Capital, Jabil, Foxconn, EDBI (arm of SG Growth Capital, the investment platform of the Singapore Economic Development Board and Enterprise Singapore), CDIB-TEN Capital, and Qatar Investment Authority (QIA), as well as strategic investors from leading silicon IC and networking companies. Existing investors Summit Partners, The Engine, Foothill Ventures, and Xora Innovation continue to actively support the company’s growth.

The financing brings together companies across the AI infrastructure value chain — including silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure investment — reflecting broad ecosystem support for scaling TFLN photonics into production.

“This financing is about more than capital — it is about ecosystem alignment,” said Mian Zhang, CEO of HyperLight. “AI infrastructure requires optical interconnects that can deliver higher bandwidth, lower power, and manufacturing scale across pluggable optics and co-packaged optics. HyperLight has spent years building the TFLN technology, manufacturing foundation, and ecosystem relationships required to support that transition. This round accelerates our ability to scale with customers and partners globally.”

HyperLight’s TFLN Chiplet™ Platform is designed to unify the requirements of short-reach IMDD-based data center pluggables, longer-reach coherent datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. With products supporting 200G-per-lane operation and 400G-per-lane solutions now sampling, the platform combines ultra-high modulation bandwidth, CMOS-level drive voltage, and ultra-low optical loss to reduce power consumption as AI networks scale to higher lane speeds. “Next-generation AI infrastructure requires optical connectivity that enables 3.2T and beyond,” said Brian Hsu, Managing Director of MediaTek Innovation Fund. “TFLN’s combination of bandwidth and efficiency makes it a compelling technology for high-speed interconnects, and HyperLight is well positioned to support this transition.”

HyperLight will use the funding to expand manufacturing capacity, accelerate customer qualification, scale its TFLN Chiplet™ Platform, and deepen partnerships across foundry, semiconductor, networking, and systems integration domains. The financing builds on HyperLight’s recently announced strategic manufacturing partnership with UMC and Wavetek for high-volume foundry production of the TFLN Chiplet™ Platform on both 6-inch and 8-inch wafers.

HyperLight’s platform approach consolidates diverse customer requirements into a standardized, production-ready architecture, reducing ecosystem complexity, lowering manufacturing risk, and enabling rapid, cost-competitive adoption of TFLN photonics at global scale.

About HyperLight

HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.

View source version on businesswire.com: https://www.businesswire.com/news/home/20260618064171/en/

“This financing is about more than capital — it is about ecosystem alignment,” said Mian Zhang, CEO of HyperLight.

Contacts

Media contact
HyperLight
Joe Balaban
joe@hyperlightcorp.com

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