Amkor Technology, Inc. (NQ: AMKR)
10.62 USD  +0.22 (+2.12%)
Official Closing Price  /  Updated: 5:20 PM EDT, Sep 2, 2014  /  Add to My Watchlist      
Price and Volume
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Volume 1,205,272
Open 10.41
Bid (Size) 10.61 (3700)
Ask (Size) 10.62 (6400)
Prev. Close 10.40
Today's Range 10.32 - 10.63
52wk Range 4.030 - 12.27
Shares Outstanding 237,106,589
Dividend Yield N/A
Performance
YTD
+73.25%
+73.25%
1 Month
+17.09%
+17.09%
3 Month
+2.91%
+2.91%
6 Month
+80.00%
+80.00%
1 Year
+159.02%
+159.02%
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EDITORS' PICKS


Overlay Metrology Suite for Multiple Patterning
08/26/2014KLA-Tencor releases WaferSight PWG, LMS IPRO6, and K-T Analyzer 9.0 to control overlay and critical dimension (CD) in advanced IC fabs....
Intel and Unity Technologies announce collaboration
08/21/2014Intel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android-based applications on Intel ...
 
Intel releases new packaging, test technologies for 14nm foundries
08/27/2014Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging ...
Fairchild Semiconductor to close two facilities, cutting 15% of workforce
08/25/2014Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its intern...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Breakthrough in light sources for new quantum technology

09/02/2014  Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

Engineers develop new sensor to detect tiny individual nanoparticles

09/02/2014  A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

09/02/2014  Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

TowerJazz and Triune Systems announce Neo-Iso Products ramping to mass production

09/02/2014  TowerJazz, the global specialty foundry, and Triune Systems LLC, a mixed signal and power management IC provider, today announced that Triune has developed a proprietary isolated power and data technology using the TowerJazz TS18PM process on its 0.18um based power management platform.

SUNY CSNE to use yield management software from Rudolph Technologies

09/02/2014  Rudolph Technologies, Inc. announced today that the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise Yield Management Software (YMS) to provide an integrated data warehouse and analytics system for the Global 450 Consortium (G450C) equipment development program.

MEI Wet Processing Systems reveals performance data for new critical etch system

09/02/2014  MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

Semiconductor and circuit manufacturing: one of the top export industries in the United States

09/02/2014  Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development.

Intel Announces “New Interconnect” for 14nm

09/02/2014  Intel has just announced that “Embedded Multi-die Interconnect Bridge (EMIB”) packaging technology will be available to 14nm foundry customers.

The Week in Review: August 29, 2014

08/29/2014  Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

UMC joins Fujitsu's new foundry company

08/29/2014  United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

Copper shines as flexible conductor

08/29/2014  Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

A new, tunable device for spintronics

08/29/2014  An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Lithography: What are the alternatives to EUV?

08/28/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

08/28/2014  SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS

Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

EVENTS

SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014

FINANCIALS

NEW COMMENTS


Fairchild Semiconductor to close two facilities, cutting 15% of workforce
MEMS devices for biomedical applications
Ion Systems launches home page to address static charge control issues

NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...
Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...